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  • Company
        • 회사소개
        • 비전
        • 연혁
        • 조직도
        • 인증
  • Product
    • 2차전지
      • LASER NOTCHING SYSTEM
      • LASER WELDING SYSTEM
      • PACKAGE ASSEMBLY LINE
    • 디스플레이
      • EXCIMER LASER ANNEALING SYSTEM
      • LASER LIFT OFF SYSTEM
      • LASER CUTTING SYSTEM
    • 반도체
      • LASER THERMAL ANNEALING SYSTEM
      • LASER LIFT-OFF SYSTEM
      • WAFER MARKING SYSTEM
      • LASER CUTTING SYSTEM
  • Technology
  • Contact
  • Location
logo main
  • Company
        • 회사소개
        • 비전
        • 연혁
        • 조직도
        • 인증
  • Product
    • 2차전지
      • LASER NOTCHING SYSTEM
      • LASER WELDING SYSTEM
      • PACKAGE ASSEMBLY LINE
    • 디스플레이
      • EXCIMER LASER ANNEALING SYSTEM
      • LASER LIFT OFF SYSTEM
      • LASER CUTTING SYSTEM
    • 반도체
      • LASER THERMAL ANNEALING SYSTEM
      • LASER LIFT-OFF SYSTEM
      • WAFER MARKING SYSTEM
      • LASER CUTTING SYSTEM
  • Technology
  • Contact
  • Location

Secondary Cell
Equipment System *Laser Notching System​ / Laser Welding System / Prismatic Assembly Line Display
Equipment System *EXLA-1000 / FLSP-S​ / FLSP-C / FLCS-G6​ / LCS-G80i Semiconductor
Equipment System *LTPS-300 / VLSP-200 / WMS-TS
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